TRADE NAME	PURITY	PARTICLE SIZE	A. D. (g/cm3)	T. D. (g/cm3)	OXYGEN	MORPHOLOGY
ECP	99.7%MIN	<45 MICRONS	1.0-1.4	1.5-1.7	<0.5%	DENTRITIC
RCP	99.5% MIN	<45 MICRONS	1.8-2.2	2.8-3.2	<0.4%	IRREGULAR
ACP	99.5% MIN	<45 MICRONS	2.8-3.2	4.1-4.4	<0.4%	IRREGULAR
NCP	99.5%MIN	<1 MICRONS	0.6-0.8	0.9-1.1	<0.6%	FLAKY

Copper Powder

Copper powder is a very dense and typically spherical metal powder that is used in the elcectronics industry due to its conductive properties.

Copper Powders are produced mainly through Electrolysis(ECP), Atomization(ACP) and Reduction(RCP) Process, further it is milled to Nano Scale(NCP).

Copper powder has many uses in powder metallurgy, including:

Manufacturing: Soft magnets, copper-based paints, inks, chemicals, and sintered components
Joining: Brazing for joining different parts
Coating: Surface coating and friction products
Nonstructural: Cold soldering, mechanical plating, medals and medallions, metal-plastic decorative products
Lubrication: Cold casting, with casting resin, epoxy, polyester or polyurethane
Cutting: Diamond cutting tool

Other uses of copper powder include:

Copper	Values
Molecular Weight	63.55
Appearance	Reddish metal in various forms
Melting Point	1085 °C
Boiling Point	2562 °C
Density	8.96 g/cm3
Solubility in H2O	N/A
Electrical Resistivity	0.39 kJ/kg·K
Electronegativity	1.90 Paulings
Heat of Fusion	13.26 kJ ·mol-1
Heat of Vaporization	300.4 kJ ·mol-1
Poisson's Ratio	0.34
Specific Heat	0.39 kJ/kg K
Thermal Conductivity	1.68 x 10-8 &Ohm;·m
Thermal Expansion	16.5 µm·m-1·K-1 (25 °C)
Vickers Hardness	369 MPa
Young's Modulus	110-128 GPa